CAJ | 학술논문

以AgCuTi合金粉末为过渡层,采用扩散连接法对石墨与铜进行扩散连接实验.利用X射线衍射仪、扫描电镜、金相显微镜及万能材料实验机对连接界面的性能及微观形貌进行研究.研究结果表明:在工艺参数为 870℃/200 kPa/10 min的条件下可实现石墨-Cu连接,其接头界面组织结构为石墨/TiC/铜基固溶体+富银区/铜;接头剪切强度为17 MPa,断裂在石墨母材;并分析了石墨/Ag-Cu-Ti/铜真空加压烧结接头的形成机理.
이AgCuTi합금분말위과도층,채용확산련접법대석묵여동진행확산련접실험.이용X사선연사의、소묘전경、금상현미경급만능재료실험궤대련접계면적성능급미관형모진행연구.연구결과표명:재공예삼수위 870℃/200 kPa/10 min적조건하가실현석묵-Cu련접,기접두계면조직결구위석묵/TiC/동기고용체+부은구/동;접두전절강도위17 MPa,단렬재석묵모재;병분석료석묵/Ag-Cu-Ti/동진공가압소결접두적형성궤리.
The graphite and copper were jointed by diffusion bonding method, using AgCuTi alloy powders as the transit layer. The mechanical properties and microstructure of the bonding surface were investigated by SEM, EDS, XRD, OM and shearing test,the forming mechanism of graphite/Ag-Cu-Ti/Cu joint sintered in vacuum pressure condition was also analyzed. The result shows that the joint of graphite and copper could be realized at 870℃/200 kPa/10 min. The typical interfacial microstructure of the joints is graphite/TiC/Cu solid solution+Ag-rich region/Cu. The shear strength of the specimens is 17 MPa, and the fracture takes place in the graphite matrix.