CAJ | 학술논문

系统级封装是实现电子产品小型化和多功能的重要技术路线，在微电子集成封装领域具有广阔的应用前景。以实际的变频单元SiP集成设计为例，介绍了利用硅基集成无源器件和倒装焊技术，在较小体积尺寸内实现有源芯片与IPD器件的三维集成，实现了变频模块的微型化设计；并利用仿真技术分析研究了各种因素对变频SIP电性能与可靠性的影响。
계통급봉장시실현전자산품소형화화다공능적중요기술로선，재미전자집성봉장영역구유엄활적응용전경。이실제적변빈단원SiP집성설계위례，개소료이용규기집성무원기건화도장한기술，재교소체적척촌내실현유원심편여IPD기건적삼유집성，실현료변빈모괴적미형화설계；병이용방진기술분석연구료각충인소대변빈SIP전성능여가고성적영향。
System in Package is an important technique for the miniaturization and multifunction of the electronic products. It has a broad development prospects in microelectronics packaging and assembly. An integrated design of RF SIP is introduced. Multiple chips and passive components are integrated into a small package by using the IPD and flip-chip technology. The influences of various factors on the reliability and the electric performance of this SIP are also analyzed by simulation technology.