CAJ | 학술논문

在多功能陶瓷基板上气密焊接金属微框是微系统模块集成制造过程中常见的组装需求，目前常规的工艺路线存在着设备依赖性强、焊接状态差异较大和返修困难等问题。介绍了一种原位自给式的焊接工艺，可用于低温共烧陶瓷基板金属微框的选择性焊接和快捷返修。研究了集成热源电阻器的设计、仿真、制作、空载测试、微框焊接及返修。结果表明，原位加热焊接微框的气密性完全满足国军标的要求。
재다공능도자기판상기밀한접금속미광시미계통모괴집성제조과정중상견적조장수구，목전상규적공예로선존재착설비의뢰성강、한접상태차이교대화반수곤난등문제。개소료일충원위자급식적한접공예，가용우저온공소도자기판금속미광적선택성한접화쾌첩반수。연구료집성열원전조기적설계、방진、제작、공재측시、미광한접급반수。결과표명，원위가열한접미광적기밀성완전만족국군표적요구。
Hermetic soldering metal frames on multi-functional ceramic substrate is needed commonly in the micro system module integration. The conventional process has several problems including strongly equipment dependence, soldering state difference and repair difficulty. A method of self-support soldering is introduced which can be used in selective soldering and convenient repairing micro frames in LTCC ISP substrate. The design, simulation, fabrication, test, frame soldering and repair of integrated resistors which act as heat source were studied. The test result shows that the value of hermetization can fully satisfy the demand of military standard.