CAJ | 학술논문

波峰焊接过程中，焊点桥接是现有波峰焊接常见缺陷之一，也是亟待需要解决的问题。为了更好地分析并解决现有的桥接缺陷问题，把影响桥接的各波峰焊参数，如助焊剂流量、波峰高度和链速等因素作为试验因子，利用正交试验设计，分析波峰焊各参数对通孔器件波峰焊桥接的影响，为波峰焊接参数的合理设置并解决波峰焊桥接问题提供参考。
파봉한접과정중，한점교접시현유파봉한접상견결함지일，야시극대수요해결적문제。위료경호지분석병해결현유적교접결함문제，파영향교접적각파봉한삼수，여조한제류량、파봉고도화련속등인소작위시험인자，이용정교시험설계，분석파봉한각삼수대통공기건파봉한교접적영향，위파봉한접삼수적합리설치병해결파봉한교접문제제공삼고。
Solder bridging is one of the common defects in the Wave Soldering at present. In order to analyze and solve the bridging defects problems, Choose the various parameters of influencing the bridge in wave soldering, for example flux flow, height of wave soldering , speed of the chain As test factors, analyze the impact of the parameters on solder bridging using orthogonal experimental design. Provide some reference theory data for setting the rational parameters of wave soldering and solve the problem of solder bridging.