机械工程学报
機械工程學報
궤계공정학보
Journal of Mechanical Engineering
2015年
21期
191-198
,共8页
刘伟%邓朝晖%万林林%赵小雨%皮舟
劉偉%鄧朝暉%萬林林%趙小雨%皮舟
류위%산조휘%만림림%조소우%피주
单颗磨粒%氮化硅%有限元仿真%截角八面体%Johnson-Holmquistceramic
單顆磨粒%氮化硅%有限元倣真%截角八麵體%Johnson-Holmquistceramic
단과마립%담화규%유한원방진%절각팔면체%Johnson-Holmquistceramic
single grain%silicon nitride%finite element simulation%truncated octahedron%Johnson-Holmquist ceramic
为探索氮化硅陶瓷单颗磨粒切削加工的机理,进行单颗金刚石磨粒切削氮化硅陶瓷的仿真与试验.选用截角八面体模拟金刚石磨粒,基于Johnson-Holmquist ceramic硬脆材料本构模型,采用有限元网格法进行单颗磨粒直线切削仿真,分析工件材料的切屑去除、划痕形貌、应力动态变化与分布、切削力变化等现象,以及工艺参数对切削力的影响.制备单颗金刚石磨粒工具,在平面磨床上进行单颗磨粒切削氮化硅陶瓷的试验,进一步分析划痕形貌、切削力的变化,并验证有限元仿真的正确性.研究表明,划痕光直平整,塑性隆起很少,边缘存在较大尺寸的破碎,划痕内有局部小尺寸的破碎;划痕的深度和宽度比磨粒的切削深度和宽度尺寸略大.应力与切削力存在动态波动.随着砂轮速度的增加,切向力和法向力减小;随着切削深度的增加,切向力和法向力增大.切削力比在4~6之间变化.
為探索氮化硅陶瓷單顆磨粒切削加工的機理,進行單顆金剛石磨粒切削氮化硅陶瓷的倣真與試驗.選用截角八麵體模擬金剛石磨粒,基于Johnson-Holmquist ceramic硬脆材料本構模型,採用有限元網格法進行單顆磨粒直線切削倣真,分析工件材料的切屑去除、劃痕形貌、應力動態變化與分佈、切削力變化等現象,以及工藝參數對切削力的影響.製備單顆金剛石磨粒工具,在平麵磨床上進行單顆磨粒切削氮化硅陶瓷的試驗,進一步分析劃痕形貌、切削力的變化,併驗證有限元倣真的正確性.研究錶明,劃痕光直平整,塑性隆起很少,邊緣存在較大呎吋的破碎,劃痕內有跼部小呎吋的破碎;劃痕的深度和寬度比磨粒的切削深度和寬度呎吋略大.應力與切削力存在動態波動.隨著砂輪速度的增加,切嚮力和法嚮力減小;隨著切削深度的增加,切嚮力和法嚮力增大.切削力比在4~6之間變化.
위탐색담화규도자단과마립절삭가공적궤리,진행단과금강석마립절삭담화규도자적방진여시험.선용절각팔면체모의금강석마립,기우Johnson-Holmquist ceramic경취재료본구모형,채용유한원망격법진행단과마립직선절삭방진,분석공건재료적절설거제、화흔형모、응력동태변화여분포、절삭력변화등현상,이급공예삼수대절삭력적영향.제비단과금강석마립공구,재평면마상상진행단과마립절삭담화규도자적시험,진일보분석화흔형모、절삭력적변화,병험증유한원방진적정학성.연구표명,화흔광직평정,소성륭기흔소,변연존재교대척촌적파쇄,화흔내유국부소척촌적파쇄;화흔적심도화관도비마립적절삭심도화관도척촌략대.응력여절삭력존재동태파동.수착사륜속도적증가,절향력화법향력감소;수착절삭심도적증가,절향력화법향력증대.절삭력비재4~6지간변화.
To explore the mechanism of silicon nitride cutting with single grain, simulation and experimental are carried out on silicon nitride cutting with single diamond grain. Choosing truncated octahedron to simulate diamond grain, based on the Johnson-Holmquist ceramic brittle material constitutive model, the single grain linear cutting simulation is modeled by finite element method. The phenomena is analyzed for workpiece material chips, scratches morphology, stress changes and distribution, and cutting forces changes, and the effect of process parameters on the cutting force is studied. With the preparation of single diamond grain tools, the silicon nitride cutting experiments are carried on surface grinding machine with cutting depth changing, to further analyze the changes of scratches morphology and cutting forces, and verify the correctness of finite element simulation. The results show that the scratches are direct and brightness, little plastic ridges, with the larger size of broken edge and small partially broken; the scratch depth and width are slightly larger than the grain cutting depth and width. Fluctuations are existed in stress and cutting force. As the wheel speed increases, the tangential force and normal force reduce; cutting depth increases, the tangential force and normal force increase. The cutting force ratio is changing between 4 and 6.