CAJ | 학술논문

新一代大规模集成电路高温动态老化系统的设计是近年来研究的热点。以现场可编程逻辑门阵列作为核心平台，通过高速数据接口，将上位机中的数据传输到老化测试芯片中，同时把老化过程中的相关数据反馈回上位机。通过FPGA软硬件平台验证表明，该数据通信接口设计能够很好地完成集成芯片的老化过程，较传统的静态老化系统有很大的改进和提高。
신일대대규모집성전로고온동태노화계통적설계시근년래연구적열점。이현장가편정라집문진렬작위핵심평태，통과고속수거접구，장상위궤중적수거전수도노화측시심편중，동시파노화과정중적상관수거반궤회상위궤。통과FPGA연경건평태험증표명，해수거통신접구설계능구흔호지완성집성심편적노화과정，교전통적정태노화계통유흔대적개진화제고。
How to design a new generation of high-temperature dynamic burn-in system LSI is a hot issue in recent years.In this paper,we use field-programmable gate array( FPGA) as a key design platform of the whole system,let the data in host computer transmit to the aging test chip,meanwhile the aging process relevant data feedback to the host computer,through a variety of high-speed data interface.Some experiments and tests based on FPGA show that the data interface can well complete the dynamic burn-in process,has greatly improved and enhanced comparing with the traditional static system.