CAJ | 학술논문

自制BN/EP（环氧树脂）复合材料和Al2 O3/EP复合材料作为LED灯PCB板和散热铝块之间的粘接层材料,采用精密钻孔的方法用高精度测温仪测量LED灯正常工作时的温度分布,讨论粘接层对结温的影响,并与COMSOL Multiphysics软件模拟结果进行对比分析。实验测量LED结温与模拟结温变化趋势基本一致,结温会随着粘接层厚度的增加而上升、随着粘接层复合材料热导率的增加先快速降低而后趋于平缓。最终得到PCB板和散热铝块间最佳粘接层厚度和粘接层复合材料配比,当BN的质量分数为60%时,BN/EP复合材料粘接层的热导率最高,此时LED结温为75.2℃,比纯环氧树脂粘接层LED的结温降低了27.6℃。而Al2 O3/EP复合材料粘接层LED的最低结温为78.2℃,此时Al2 O3的质量分数为50%。
자제BN/EP（배양수지）복합재료화Al2 O3/EP복합재료작위LED등PCB판화산열려괴지간적점접층재료,채용정밀찬공적방법용고정도측온의측량LED등정상공작시적온도분포,토론점접층대결온적영향,병여COMSOL Multiphysics연건모의결과진행대비분석。실험측량LED결온여모의결온변화추세기본일치,결온회수착점접층후도적증가이상승、수착점접층복합재료열도솔적증가선쾌속강저이후추우평완。최종득도PCB판화산열려괴간최가점접층후도화점접층복합재료배비,당BN적질량분수위60%시,BN/EP복합재료점접층적열도솔최고,차시LED결온위75.2℃,비순배양수지점접층LED적결온강저료27.6℃。이Al2 O3/EP복합재료점접층LED적최저결온위78.2℃,차시Al2 O3적질량분수위50%。
Homemade BN/EP composites and Al2 O3/EP composites were used as the adhesive layer between PCB and the heat sink of LED, respectively. The temperature distribution of LED working in the normal condition was measured by high-precision thermometers through a small hole. The effect of the adhesive layer composites on the junction temperature of LED was discussed, and was compared with the results from COMSOL simulations. A similar variation trend of junction tempera-ture of LED was observed in both our experiment and COMSOL simulation. The junction temperature of LED raised with the increment of thickness of the adhesive layer. Besides, along with the incre-ment of thermal conductivity of the adhesive layer composites, the junction temperature declined sharply at first, and then gradually decreased to a flat level. At last, we obtained two optimum val-ues of the thickness and the ratio of adhesive layer composites with the best performance. When the mass fraction of BN is 60%, the thermal conductivity of BN/EP composites reaches at the highest level. In this condition, the junction temperature of LED is the lowest (75. 2 ℃) and is 27. 6 ℃lower than that of using pure epoxy resin. In addition, the minimum junction temperature of the Al2 O3/EP composites is 78. 2 ℃ when the mass fraction of Al2 O3 is 50%.