CAJ | 학술논문

在军用铝合金微波模块中焊接尺寸较大的LTCC器件时，由于热失配的存在，易出现应力过大甚至开裂。当采用陶瓷基板时问题更为突出。在此采用有限元分析方法研究了这类结构在温度循环过程中应力变化和分布的特点。研究结果表明，当采用陶瓷基板时，封装盒底厚度与其上各层结构（包括过渡层垫板，陶瓷基板和陶瓷元件）厚度的不合理匹配会导致陶瓷器件产生过高应力，可靠性降低。合理的设计应是减小过渡层垫板和陶瓷基板厚度，同时增加封装盒底厚度。
재군용려합금미파모괴중한접척촌교대적LTCC기건시，유우열실배적존재，역출현응력과대심지개렬。당채용도자기판시문제경위돌출。재차채용유한원분석방법연구료저류결구재온도순배과정중응력변화화분포적특점。연구결과표명，당채용도자기판시，봉장합저후도여기상각층결구（포괄과도층점판，도자기판화도자원건）후도적불합리필배회도치도자기건산생과고응력，가고성강저。합리적설계응시감소과도층점판화도자기판후도，동시증가봉장합저후도。
High stress and even failure problem,induced by thermal expansion mismatch,are usually observed in the sol?dered LTCC component in microwave module with aluminum alloy package,especially when ceramic substrate is used. The stress evolution and distribution of such structure were analyzed with finite element method. The results show that for ceramic substrate,too high stress primarily results from the mismatch of the thickness of package bottom and each architecture adhering to the bottom(such as stress transition layer,ceramic substrate and ceramic component). Proper design strategy is to decrease in the thickness of stress transition layer and ceramic substrate,and increase in the thickness of package bottom.